The connectivity and assembly density of board components is increasing due to the development of light, small, thin, multi-functional, and high-density electrical items. Because power dissipation is becoming increasingly massive, heat dissipation is becoming increasingly important on PCB substrates. If the substrates have inadequate heat dissipation, the components on the board will become overheated, resulting in machine unreliability. As a result, the pz22 manufacturer invented PCB substrate.
The best Pz22 manufacturers in China
The PCB substrates in PCB manufacturing are copper clad laminate (CCL), the most extensive and essential utilized to build the boards.
Printed circuit board (PCB) substances are one of the most often utilized materials for board fabrication. They are resin-soaked materials with electronic glass fiber or other reinforcing material to contribute to the copper-clad on one side of the board. Radios, computers, televisions, mobile devices, and various electronic assemblies use copper-coated laminate.
Copper sheets are frequently galvanized before being galvanized to prevent them from corrosion. The sheathing is done with thicker sheets while tooling and decorating are done with thinner foils. As a PZ 22 supplier, provide copper plates, coil, copper sheets, brass rods, tubing, and constructions. Also, to eliminate the need for future repairs, all materials are thoroughly checked and tested before being dispatched.
Moreover, copperplates and sheets are used for a variety of purposes. Because of their excellent dimensional control and high fracture resistance, these materials are simple to cut, machine, and mold. It’s also used as a conductive copper foil tape for electrical direction tape, warming patches, and EMI/RFI protection for engines.
Laminate Materials with a Copper Clad
For copper-clad laminates, fabricators often use prepreg, a strengthening material already saturated with a resin containing an appropriate curing agent. The resin is supplied in a pre-dried, unhardened state. The fabricator warms the prepreg before sandwiching it between two layers of copper foils in a mold.
Prepreg: A prepreg (from pre-impregnated) is essentially resin-impregnated fiberglass. The raisin must be dried beforehand but not too stiffened to flow and submerge during the cooking process. Like the FR4 material we discussed before in the essay, Prepregs are fiberglass reinforced and strengthened with an adhesive afterward.
Moreover, pz22 manufacturers have varied needs regarding thickness and particular types of prepreg. In addition, the resin composition determines the versions “SR” Standard Resin, “HR” High Resin, and “MR” Medium Resin. The optimal material to employ is determined by the highest layer of structure, thickness, and impedance needed.
Also, Copper Foil is an electrolytic cathodic material made of copper foil. The PCB is placed on a thin and continuous layer of metal foil. It is simple to connect to an insulating layer, resulting in the production of a printed protective coating that will shield the board from corrosion.
Types of Copper Clad Laminates
Each PCB has its own set of criteria and standards, which the designers or engineers in charge of the assembly’s creation are taken into account. We will go through the many copper-clad laminates utilized in PCB development.
Copper clad laminate (CCL) is divided into two types:
· Rigid Copper Clad Laminate
CCLs can be organic raisin copper-clad laminates, ceramic base copper-clad laminates, or metal-core copper laminates, depending on the insulating materials and division structure. The CCL might be a traditional copper-clad laminate or a thin copper-clad laminate if the thickness is considered. Also, rigid copper-covered laminates are flame-retardant and have several unique features.
Further, Paper-based copper-clad laminates, electronic fiberglass cloth-based copper-clad laminates, and composite base copper-clad laminates were used as reinforcing materials. Also, Polyester resin copper-clad laminates, epoxy resin copper-clad laminates, and cyanate resin copper-clad laminates are all possible insulating resins for CCLs.
· Flexible Copper Clad Laminates
Polyamide varieties can be flame retardant and non-flame retardant, and they can also be flame resistant and non-flame resistant polyester and fragile electronic fiberglass fabric copper-clad laminates.
Copper Clad Laminate Type
Copper-clad laminates are not restricted just to these two kinds. Now we’ll look at some of the more generally used varieties of CCLs throughout the world.
We’ll also go over some of their more general characteristics, such as flammability, flexural strength, thermal expansion coefficient, Tg, etc.
1. CEM-3 (Composite Epoxy Materials Grade-3)
It is an FR0-4-based fiberglass composite material with a blend of woven and non-woven glass fibers and core raisin filler. It’s frequently a milky white hue. CEM-3 has lesser mechanical durability than other copper-clad laminates, such as FR-4, yet it is a more cost-effective alternative.
- Thermal Expansion Coefficient- ~55ppm/℃ before Tg to~285ppm/℃ after Tg
- Tg – 130°C Flexural Strength – 300400Mpa Lengthwise / 200300Mpa Crosswise
- UL-94V0 flammability
- 54.8 Dielectric Constant At 1MHz
- Tangent Loss @ 1MHz – 0.020
- Thermal Conductivity – Up to 0.8 watts per meter squared
2. FR-4
It is the most widely used copper-clad laminate on the planet. FR-4 is a high-performance material that is also less expensive than other specialty materials. Meanwhile, this material has been thoroughly recognized and investigated, and it can now be tweaked to generate a range of valuable boards, including halogen-free versions.
- Flammability – UL-94V0
- Flexural strength: 500 to 600 MPa longitudinally and 400 to 500 MPa across
- 7 dielectric constant at 1MHz
- Thermal conductivity of up to 0.8 watts per meter squared
- Thermal expansion coefficient: 55ppm/°C before Tg, 285ppm/°C after Tg
3. Aluminum
Another typical material used in producing printed circuit boards is polyimide, and its remarkable dissipation qualities make it popular and frequently utilized in high-power and LED devices.
- Flammability – UL-94V0
- 03.0w/MK thermal conductivity
- Flexural strength – ~450Mpa lengthwise / ~390Mpa crosswise
- Coefficient of thermal expansion – ~27ppm/℃ before Tg / ~30ppm/℃ after Tg
- Dielectric breakdown – 6.0KV
4. Polyimide (PI)
It’s one of the most heat-resistant high-molecular-weight organic polymers on the market. It is the primary material used in producing flexible printed boards because of its softness.
- Tensile strength – ~72Mpa
- Flammability – UL-94V0
- Thermal conductivity – ~0.2w/mk
- Tg – >250℃
- Thermal expansion coefficient: 55ppm/°C before Tg, 149ppm/°C after Tg
- Dielectric constant @ 1MHz – 4.2
- Loss tangent @ 1MHz – 0.018
5. Poly Tetrafluoroethylene (PTFE) or “Teflon”
Compared to traditional high-frequency materials, it is a synthetic polymer material with improved dielectric characteristics. It’s a good choice for specific or high-demand microwave/RF products. The only issue here is the high price, which the makers must carefully examine.
- Flammability – UL-94V0
- Coefficient of thermal expansion – 70ppm/℃
- Flexural strength – >276Mpa lengthwise / >241Mpa crosswise
- Tg – >280℃
- Thermal conductivity – 0.24w/mk
- Loss tangent @ 1MHz – 0.003
